Electronic Manufacturing with Though-hole Technology and 0.4mm IC Minimum Precision

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Basic Info

Payment Type:	Telegraphic Transfer (TT,T/T)

Product Description

PCB material: CEM3, FR2, FR4 and Al

PCBY layers: 1 to 32 layers

PCB process: HASL, Au plating, Au/SP immersion and OSP

PCB fabrication, hand insertion, metal assembly and function test

Conventional coating: 0201, 0402, 0603, 0805, 1210 and 2512 placement

BGA precision: 0.5mm (minimum)

IC precision: 0.4mm (minimum)

Experienced components sourcing team

Specially for scarce parts

Through-hole technology

One-stop station EMS services provider

1 to 22 layers mixed assembly technology, specialized in assembling boards for safety, industry control and power boards

Available in various specifications

Production line types of supports:

SMT (Yamaha and Sanyo machine)

Plastic injection factory service

Die-casting and sheet metal stamping factory

X-ray and ICT test, function test and assembly line

Supports type of production line

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