Shenzhen Leadsin Technology Co. Ltd
Shenzhen Leadsin Technology Co. Ltd
Electronic Relays Controls, Supply with 4 Layer, Customized Board Thickness
  • Electronic Relays Controls, Supply with 4 Layer, Customized Board Thickness
Electronic Relays Controls, Supply with 4 Layer, Customized Board Thickness

Electronic Relays Controls, Supply with 4 Layer, Customized Board Thickness

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Basic Info
Basic Info
Payment Type: Telegraphic Transfer (TT,T/T)
Product Description
Product Description
  • We supply 100% EMS solution for customer from components to final products
  • Full manufacturing solution for PCBA/SMT/TH/final PCB assembly
  • IPC-610-D inspection standard
  • ISO9001 factory certificate
  • Provides EMS services to all kind of printed circuit board assemblies
  • We provide real vertically integrated OEM service form procurement, plastic, tooling/injection
  • PCB assembly, die casting, stamping, assembly/testing, quality assurance and shipping
  • Programming, in-circuit testing and function testing
  • Conformal and waterproof coating, painting, silk-screen, conventional coating accepted for harsh productions
  • Capable of developing effective production process to ensure high quality and consistency
  • Reliable circuit board available in soldering and casing assembly
  • Experienced electronics supply chain management
  • Flexible production for customer's required low, middle and high volumes
  • Cost effective, competitive price, reduce cost pressure for customer
  • Import and export license for critical parts
  • PCBA quality guaranteed 12month warranty for all boards
  • Primary competitive advantages:
    • Experienced technical staff
    • Competitive price
    • Product features
    • Customized service
    • Small orders are accepted
    • Quality approval
    • Compliant with the RoHS Directive
    • Manufacturing capability
    • PCB layers: 1 to 12 layers (max)
    • Material: FR4
    • Copper thickness: 35um
    • Surface finish: HASL, ENIG, OSP
    • Min holes: 0.2mm
    • Min wire width: 0.2mm
    • Min clearance: 0.2mm
    • PCB dimensions: 457 x 567cm (max) and 4 x 3cm (min)
    • IC pitch (min): 0.2mm
    • Chip size (min): 0402/1005 (1.0 x 0.5mm)
    • BGA size: 8 x 6 and 55 x55mm
    • BGA pin count: 48 to 600 pins
    • Package: SOP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
    • U-BGA ball diameter: 0.2mm
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