Shenzhen Sunshine Circuits Technology Co. Ltd
Shenzhen Sunshine Circuits Technology Co. Ltd
Mech. Blind Board, 0.9 Minimum Via Diameter
  • Mech. Blind Board, 0.9 Minimum Via Diameter
Mech. Blind Board, 0.9 Minimum Via Diameter

Mech. Blind Board, 0.9 Minimum Via Diameter

Payment Type:
Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Finish thickness: 1.575mm ± 10%
  • Min width/spacing: 0.3/0.3mil (minimum)
  • Via diameter: 0.9mm (minimum)
  • Surface finish: ENIG
  • Specialty: L1-2: mechanical blind via of 0.5mm, buried via can not be filled after pressing
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