Shenzhen Sunshine Circuits Technology Co. Ltd
Shenzhen Sunshine Circuits Technology Co. Ltd
Multilayer HDI PCB with Finishing Thickness of 1.3±0.13mm
  • Multilayer HDI PCB with Finishing Thickness of 1.3±0.13mm
Multilayer HDI PCB with Finishing Thickness of 1.3±0.13mm

Multilayer HDI PCB with Finishing Thickness of 1.3±0.13mm

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Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Blind and buried via board
  • Surface finish: ENIG
  • L3L4 buried via: 0.25mm
  • Blind via: 0.25mm
  • Minimum PTH: 0.35mm
  • Minimum width/spacing: 6/6mil
  • Finishing thickness: 1.3±0.13mm
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