
High-density Multilayer PCB with HASL Surface Finish and Thickness of 1.6 ±0.16mm
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Basic Info
Payment Type: | Telegraphic Transfer in Advance (Advance TT, T/T) |
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Product Description
Product Description
- Laser blind via: Ø0.2mm
- Buried via: Ø0.3mm
- L1-2/L5-6: laser blind via
- Laser dielectric thickness: 190um
- L1/L6: characteristic impedance with 50 ±5Ω
- Blind via aspect ratio: 1:1
- L1-2/L5-6: laser blind via
- L2-5: buried via
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