Shenzhen Sunshine Circuits Technology Co. Ltd
Shenzhen Sunshine Circuits Technology Co. Ltd
High Density Multilayer PCB with ENIG Surface Finish; HDI(1+(2)+1)
  • High Density Multilayer PCB with ENIG Surface Finish; HDI(1+(2)+1)
High Density Multilayer PCB with ENIG Surface Finish; HDI(1+(2)+1)

High Density Multilayer PCB with ENIG Surface Finish; HDI(1+(2)+1)

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Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Layer count:4
  • Finish thickness: 0.4±0.06mm
  • Min width/spacing: 0.15/0.15mm
  • Min. via dia: 0.25mm
  • Surface finish: ENIG
  • Specialty:
  • L1, 2: laser blind via with 0.15mm dia
  • L2, 3: buried via with 0.3mm dia
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