HDI/High-density Multilayer PCB with ENIG Surface Finish

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Layer count: 8

Finish thickness: 2.0 ±0.2mm

Minimum width/spacing: 0.1/0.1mm

Minimum via diameter: 0.35mm

Surface finish: ENIG

Specialty:

L1-2, L2-3, L3-4, L5-6, L6-7, L7-8: laser blind via with dia of 0.13mm

L4-5, L2-7: Mech. Buried via with diameter of 0.3mm.

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