Shenzhen Sunshine Circuits Technology Co. Ltd
Shenzhen Sunshine Circuits Technology Co. Ltd
High-density Multilayer PCBs (1+6+1), 0.13mm Blind Via
  • High-density Multilayer PCBs (1+6+1), 0.13mm Blind Via
High-density Multilayer PCBs (1+6+1), 0.13mm Blind Via

High-density Multilayer PCBs (1+6+1), 0.13mm Blind Via

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Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Layer count: 8
  • Finish thickness: 1.575±0.1575mm
  • Minimum width/spacing: 4mil/4mil
  • Via diameter:
    • Blind via: 0.13mm
    • PTH: 0.2mm
  • Surface finish: ENIG
  • Specialty: L1-2:Laser blind via;L1,L3,L6,L8: characteristic impedance:50±5Ω and differential impedance 100±20Ω
  • Blind via: 0.13mm
  • PTH: 0.2mm
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