High-density Multilayer PCB, HDI (1+(10)+1)

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Layer count: 12

Finish thickness: 1.8 ±0.18mm

Min. width/spacing: 0.12/0.12mm

Min. via dia.: 0.4mm

Surface finish: ENIG

Specialty:

L1-2, L11-12: laser blind via of 0.127mm，filled by plating

L2-11: buried via of 0.3mm

L2, L4, L5, L8, L9, L11: characteristic impedance with 50Ω ±10%

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