High-density Multi-layer PCB with 0.45 Minimum Via Diameter, ENIG Surface Finish

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Layer count: 6

Finish thickness: 1.6 ±10%mm

Minimum width/spacing: 7/7 mils

Minimum via diameter: 0.45mm

Surface finish: ENIG

Specialty:

L3-4: buried via of 0.4mm

L2-3, L4-5, L5-6: laser via of 0.15mm

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