
HDI (1 + (2) + 1) Multi-layered PCB with ENIG Surface Finish and 0.35mm Minimum Via Diameter
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Payment Type: | Telegraphic Transfer in Advance (Advance TT, T/T) |
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Product Description
Product Description
- L2-3: buried via of 0.25mm
- L3-4: laser blind via of 0.15mm
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