HDI Board with ENIG Surface Finish

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Layer count: 10

Finish thickness: 1.6 ± 0.16mm

Minimum width/spacing: 5/5 mils

Minimum via diameter: 0.3mm

Surface finish: ENIG

Specialty:

L1-2, L9-10: laser blind via of 0.13mm
L2-9: mechanical buried via of 0.3mm
All laser blind via are filled by plating
L1, L3, L4, L10: characteristic impedance of 55 ± 10%Ω, differential impedance of 60 ± 10%Ω

L1-2, L9-10: laser blind via of 0.13mm

L2-9: mechanical buried via of 0.3mm

All laser blind via are filled by plating

L1, L3, L4, L10: characteristic impedance of 55 ± 10%Ω, differential impedance of 60 ± 10%Ω

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