HDI 1+2+1 Board/High-density Multilayer PCB, 0.35mm Minimum Via Diameter

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Specifications:

Layers count: 4

Finish thickness: 1.575 ±10mm

Min width/spacing: 6/6 mils

Minimum via diameter: 0.35mm

Surface finish: ENIG

Specialties: L1-2, L3-4

Laser blind via: 0.15mm

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