Multi-layered HDI Board with ENIG Surface Finish, 0.12mm Minimum Width/Spacing

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Finishing thickness: 1.475 ±10%mm

Minimum width/spacing: 0.12mm

Minimum via diameter: 0.2mm

Surface finishing: ENIG

Specialty: L1-2, L2-3, L4-5, L5-6: laser blind via of 0.1mm, all laser blind via are filled by plating, L1, L3, L4, L6: differential impedance of 97 ±9Ω, characteristic impedance of 50 ±5Ω

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