2 + (4) + 2 HDI Board with 0.15mm Minimum Via Diameter, ENIG Surface Finish

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Layers count: 8

Finishing thickness: 0.8 ±0.1mm

Minimum width/spacing: 2/3-mil

Minimum via diameter: 0.15mm

Surface finishing: ENIG

Specialty: L1-2, L2-3, L6-7, L7-8: laser blind via of 0.1mm, L3-6: buried via of 0.15mm, all laser blind vias are filled by plating, L1, L3, L6, L8: characteristic impedance with 45Ω ± 10% and differential impedance with 85Ω ± 10%

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