2+（12）+2 stacked via HDI with impedance control

2+（12）+2 stacked via HDI with impedance control

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

L1-2, L2-3, L14-15, L15-16 laser drill blind via 0.10mm, L3-14 buried via 0.2mm, through hoe 0.25mm

L1-2，L2-3, L14-15, L15-16 laser drill blind via plated, L3-14 buried via with resin fill, L1-3, L14-16 with stacked via, Line W/S 0.10/0.010mm, L1, L3, L5, L7, L10, L12, L14, L16 total 8 groups of characteristic impedance 50±10% Ω and 52±10% Ω, 8 groups of differential impedance 90±10%Ω

Finished board thickness: 1.6±10%mm

Layer count: 16L

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