2+(2)+2 Stacked via HDI Impedance Board

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Layer counts: 6

Finishthickness: 1.6±0.13mm

Min width/spacing range: 0.075/0.075mm

Min. Via dia: 0.2mm

Surface finish: ENIG

Specialty:

L1-2, L2-3: Laser blind via of 0.10mm, L3-4: buried via of 0.15mm
L1-2, L2-3: Laser blind via filled by plating, L3-4: buried via & some PTH filled by resin, L1-3, L1-4: stacked via
L1, L6: Differential impedance 100±10%Ω, 90±10%Ω

L1-2, L2-3: Laser blind via of 0.10mm, L3-4: buried via of 0.15mm

L1-2, L2-3: Laser blind via filled by plating, L3-4: buried via & some PTH filled by resin, L1-3, L1-4: stacked via

L1, L6: Differential impedance 100±10%Ω, 90±10%Ω

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