Shenzhen Sunshine Circuits Technology Co. Ltd
Shenzhen Sunshine Circuits Technology Co. Ltd
Stacked Via Impedance HDINew
  • Stacked Via Impedance HDINew
  • Stacked Via Impedance HDINew
Stacked Via Impedance HDINew
Stacked Via Impedance HDINew

Stacked Via Impedance HDINew

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Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Layer count: 8
  • Finish thickness: 1.575±10%mm
  • Min width/spacing: 0.076/0.076mm
  • Min. via dia.: 0.2mm
  • Surface finish: ENIG
  • Specialty: L1-2, L2-3, L6-7, L7-8: Laser blind 0.2mm via, L3-6: Buried 0.2mm via, L2-3, L6-7: Laser blind via filled by plating, L1, L8:4 groups characteristic impedance of 50±5Ω, 5 groups differential impedance of 50±5Ω
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