High-density MC PCB and SMD Components, Suppliers with E-test

High-density MC PCB and SMD Components, Suppliers with E-test

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Basic Info

Payment Type:	L/C, T/T or PayPal

Product Description

Board thickness: 1.6mm

Layers: 4

Minimum line width/spacing: 4-mil

Minimum hole diameter: 0.3mm

Finish copper thickness: 1oz

Surface finishing: immersion gold

Solder mask: green

Craft ability table:

Minimum line width/spacing: 0.075/0.075mm
Minimum solder mask dam: 0.075mm
Minimum and maximum board thickness: 0.2-3.5mm
Maximum finishing copper thickness: 0.5-4oz
Maximum layers count: 8

Impedance control: ±8%

Materials:

FR-4/Hi Tg FR-4/lead-free
With RoHS compliant/CEM-3, aluminum, metal based

Layer no: 1-16

Finished board thickness: 0.2-3.5mm (8-138-mil)

Board thickness tolerance: ±10%

Cooper thickness: 0.5-4oz (18-144um)

Copper plating hole: 18-40um

Impedance control: ±10%

Warp and twist: 0.70%

Image:

Minimum trace width: 0.075mm (3-mil)
Minimum space width: 0.075mm (- mil)
SMD pitch: 0.2mm (8-mil)
BGA pitch: 0.2mm (8-mil)

Solder mask:

Minimum solder mask dam: 0.0635mm (2.5-mil)
Soldermask clearance: 0.075mm (3-mil)
Minimum SMT pad spacing: 0.075mm (3-mil)
Solder mask thickness: 0.0007-inch (0.018mm)

Holes:

Minimum hole size (CNC): 0.2mm (8-mil)
Minimum punch hole size: 0.9mm (35-mil)
Hole size tol (+/-): PTH: ±0.075mm, NPTH: ±0.05mm
Hole position tol: ±0.075mm

Plating:

HASL/lead-free HASL: 2.5um
Immersion gold nickel: 3-7um, Au: 1-5u-inch
With OSP

Minimum line width/spacing: 0.075/0.075mm

Minimum solder mask dam: 0.075mm

Minimum and maximum board thickness: 0.2-3.5mm

Maximum finishing copper thickness: 0.5-4oz

Maximum layers count: 8

FR-4/Hi Tg FR-4/lead-free

With RoHS compliant/CEM-3, aluminum, metal based

Minimum trace width: 0.075mm (3-mil)

Minimum space width: 0.075mm (- mil)

SMD pitch: 0.2mm (8-mil)

BGA pitch: 0.2mm (8-mil)

Minimum solder mask dam: 0.0635mm (2.5-mil)

Soldermask clearance: 0.075mm (3-mil)

Minimum SMT pad spacing: 0.075mm (3-mil)

Solder mask thickness: 0.0007-inch (0.018mm)

Minimum hole size (CNC): 0.2mm (8-mil)

Minimum punch hole size: 0.9mm (35-mil)

Hole size tol (+/-): PTH: ±0.075mm, NPTH: ±0.05mm

Hole position tol: ±0.075mm

HASL/lead-free HASL: 2.5um

Immersion gold nickel: 3-7um, Au: 1-5u-inch

With OSP

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