Shenzhen Keyou Circuit Technology Co. Ltd
Products
Products
Shenzhen Keyou Circuit Technology Co. Ltd
Making Customization Circuit Board with Immersion Gold, 1.6mm Board Thickness
  • Making Customization Circuit Board with Immersion Gold, 1.6mm Board Thickness
Making Customization Circuit Board with Immersion Gold, 1.6mm Board Thickness

Making Customization Circuit Board with Immersion Gold, 1.6mm Board Thickness

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Basic Info
Basic Info
Payment Type: L/C, T/T or PayPal
Product Description
Product Description
  • Specifications:
    • Board thickness: 1.6mm
    • Layers: 2
    • Minimum line width/spacing: 4-mil
    • Minimum hole diameter: 0.3mm
    • Finish copper thickness: 1oz
    • Surface finishing: immersion gold
    • Solder mask: green
  • Craft ability table:
    • Minimum line width/spacing: 0.075/0.075mm
    • Minimum solder mask dam: 0.075mm
    • Minimum and maximum board thickness: 0.2-3.5mm
    • Maximum finish copper thickness: 0.5-4oz
    • Maximum layers count: 8
    • Impedance control: ±8%
  • Materials that we keep in stock are:
    • FR4 (Tg – 135C, 145C, 170C)
    • Rogers Ultralam 2000
    • Rogers RO4350
    • Rogers RO4003
    • Polyimide
    • Teflon
    • Black FR4
    • Getek copper
    • Clad thermal substrates
    • Hybrid (Rogers and FR4)
    • BT epoxy
    • Nelco 4013
    • If you don’t see the material above, please contact us because we most likely have it in stock or can special order it for you
  • Finishes we are able to provide our customers:
    • HASL – leaded solder tin/nickel
    • HASL – lead-free solder
    • Electroless soft gold
    • Wire bondable soft gold
    • Nickel flash gold
    • Electroless nickel
    • Immersion gold OSP
    • Electrolytic nickel/hard gold and selective gold
    • Immersion silver
    • Immersion tin
    • Carbon ink
    • ENIG
    • Please contact us if you need a finish that is not listed here
  • Board thickness: 1.6mm
  • Layers: 2
  • Minimum line width/spacing: 4-mil
  • Minimum hole diameter: 0.3mm
  • Finish copper thickness: 1oz
  • Surface finishing: immersion gold
  • Solder mask: green
  • Minimum line width/spacing: 0.075/0.075mm
  • Minimum solder mask dam: 0.075mm
  • Minimum and maximum board thickness: 0.2-3.5mm
  • Maximum finish copper thickness: 0.5-4oz
  • Maximum layers count: 8
  • Impedance control: ±8%
  • FR4 (Tg – 135C, 145C, 170C)
  • Rogers Ultralam 2000
  • Rogers RO4350
  • Rogers RO4003
  • Polyimide
  • Teflon
  • Black FR4
  • Getek copper
  • Clad thermal substrates
  • Hybrid (Rogers and FR4)
  • BT epoxy
  • Nelco 4013
  • If you don’t see the material above, please contact us because we most likely have it in stock or can special order it for you
  • HASL – leaded solder tin/nickel
  • HASL – lead-free solder
  • Electroless soft gold
  • Wire bondable soft gold
  • Nickel flash gold
  • Electroless nickel
  • Immersion gold OSP
  • Electrolytic nickel/hard gold and selective gold
  • Immersion silver
  • Immersion tin
  • Carbon ink
  • ENIG
  • Please contact us if you need a finish that is not listed here

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