Multiple wiring printed board for smart phones, BGA

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Basic Info

Payment Type:	TT,LC,PAYPAL

Product Description

Board thickness: 1.6mm

Layers: 6

Minimum line width/spacing: 4Mil

Minimum hole diameter: 4Mil

Finish copper thickness: 1oz

Surface finish: Lead free HAL

Solder mask: Green

Craft ability table:

Minimum line width/spacing: 0.075/0.075mm

Minimum solder mask dam: 0.075mm

Minimum and maximum board thicknesses: 0.2 mm-3.5mm

Maximum finish copper thickness: 0.5-4Oz

Maximum layers count: 8

Impedance control: ±8%

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