Substrate FR4 Multilayer 4 Layers PCB, 1oz Cu 1.6mm Board Thickness

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Basic Info

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Product Description

Base material: FR4, aluminum basis, copper basis

Board thickness: 1.6mm

Layers: 4L

Minimum hole diameter: 0.3mm

Finishing copper thickness: 1oz

Surface finishing: Immersion gold/Tin/Silver

Solder mask: green

Minimum line width/spacing: 0.075/0.075mm

Minimum solder mask dam: 0.075mm

Minimum and maximum board thickness: 0.2-3.2mm

Maximum finishing copper thickness: 1oz

Maximum layers count: 8

Impedance control: ±8%

Flying probe test/fixture test for every single products, to make sure 100% pass

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