Shenzhen Keyou Circuit Technology Co. Ltd
Shenzhen Keyou Circuit Technology Co. Ltd
Multiple Layered PCB with Immersion Gold, Used for Telecommunication Products
  • Multiple Layered PCB with Immersion Gold, Used for Telecommunication Products
Multiple Layered PCB with Immersion Gold, Used for Telecommunication Products

Multiple Layered PCB with Immersion Gold, Used for Telecommunication Products

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TT, LC, PAYPAL
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Basic Info
Basic Info
Payment Type: TT,LC,PAYPAL
Product Description
Product Description
  • Base material:
    • Board thickness: 1.6mm
    • Layers: 2
    • Minimum line width/spacing: 4Mil
    • Minimum hole diameter: 0.3mm
    • Finish copper thickness: 1oz
    • Surface finish: Immersion gold
    • Solder mask: Green
  • Craft ability table:
    • Minimum line width/spacing: 0.075/0.075mm
    • Minimum solder mask dam: 0.075mm
    • Minimum and maximum board thickness: 0.2-3.5mm
    • Maximum finish copper thickness: 0.5-4oz
    • Maximum layers count: 8
    • Impedance control: ±8%
  • Board thickness: 1.6mm
  • Layers: 2
  • Minimum line width/spacing: 4Mil
  • Minimum hole diameter: 0.3mm
  • Finish copper thickness: 1oz
  • Surface finish: Immersion gold
  • Solder mask: Green
  • Minimum line width/spacing: 0.075/0.075mm
  • Minimum solder mask dam: 0.075mm
  • Minimum and maximum board thickness: 0.2-3.5mm
  • Maximum finish copper thickness: 0.5-4oz
  • Maximum layers count: 8
  • Impedance control: ±8%
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