FR-4 PCB with Immersion Gold for Mobile Phone within 24 Hours

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Basic Info

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Product Description

Features:

Layer count: 4 layers
Major material: FR4
Board thickness: 1.6mm
Surface finishing: immersion gold
Solder mask: green
Copper thickness: 1oz
Min hole size: 0.3mm
Min line width and spacing: 4mil
The following is the whole manufacturer capacibility:
Item:
- Material: FR-4/Hi-Tg FR-4/lead-free materials (RoHS compliant)/CEM-3, aluminum, metal based
- Layer No: 1~16
- Finished board thickness: 0.2-3.5mm (8-138mil)
- Board thickness tolerance: ±10%
- Cooper thickness: 0.5-4oz (18-144um)
- Copper plating hole: 18-40um
- Impedance control: ±10%
- Warp and twist: 0.70%
Image:
- Min trace width (a): 0.075mm (3mil)
- Min space width (b): 0.075mm (3mil)
- SMD pitch (a): 0.2mm (8mil)
- BGA pitch (b): 0.2mm (8mil)
Solder mask:
- Min solder mask dam (a): 0.0635mm (2.5mil)
- Soldermask clearance (b): 0.075mm (3mil)
- Min SMT pad spacing (c): 0.075mm (3mil)
- Solder mask thickness: 0.0007-inch (0.018mm)
Holes:
- Min hole size (CNC): 0.2mm (8mil)
- Min punch hole size: 0.9mm (35mil)
- Hole size tol:
  - TH: ±0.075mm
  - NPTH: ±0.05mm
- Hole position tol: ±0.075mm
- Plating:
  - HASL/lead-free:
  - HASL: 2.5um
- Immersion:
- Gold nickel: 3-7um
- Au: 1-5u-inch
- OSP: 0.2-0.5um
Certificates: RoHS, SGS, UL

Layer count: 4 layers

Major material: FR4

Board thickness: 1.6mm

Surface finishing: immersion gold

Solder mask: green

Copper thickness: 1oz

Min hole size: 0.3mm

Min line width and spacing: 4mil

The following is the whole manufacturer capacibility:

Item:

Material: FR-4/Hi-Tg FR-4/lead-free materials (RoHS compliant)/CEM-3, aluminum, metal based
Layer No: 1~16
Finished board thickness: 0.2-3.5mm (8-138mil)
Board thickness tolerance: ±10%
Cooper thickness: 0.5-4oz (18-144um)
Copper plating hole: 18-40um
Impedance control: ±10%
Warp and twist: 0.70%

Image: