1oz Copper Thickness Double-sided PCB for HDI

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Basic Info

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Product Description

Layer counts: 2

Major material: FR4

Board thickness: 1.6mm

Surface finishing: lead-free

Solder mask: green

Copper thickness: 1oz

Minimum hole size: 0.3mm

Minimum line width and spacing: 4mil

Image:

Solder mask:

Holes:

Plating:

Certificates: RoHS, ISO 9001:2008, SGS, UL

Minimum trace width: 0.075mm (3 mil)

Minimum space width: 0.075mm (3 mil)

SMD/BGA pitch: 0.2 mm(8 mil)

Minimum soldermask dam: 0.0635 mm (2.5mil)

Soldermask clearance: 0.075mm (3 mil)

Minimum SMT pad spacing: 0.075mm (3 mil)

Soldermask thickness: 0.0007" (0.018mm)

Minimum size (CNC): 0.2 mm (8 mil)

Minimum punch size: 0.9 mm (35 mil)

Size tol (+/-): PTH ±0.075mm NPTH ±0.05mm

Position tol: ±0.075mm

Lead-free HASL: 2.5um

Immersion gold nickel: 3-7um Au 1-5u"

OSP: 0.2-0.5um

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