Shenzhen Keyou Circuit Technology Co. Ltd
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Shenzhen Keyou Circuit Technology Co. Ltd
Turnkey PCB manufacturer with 1.6mm FR4 94V0 and HAL lead free finishing
  • Turnkey PCB manufacturer with 1.6mm FR4 94V0 and HAL lead free finishing
Turnkey PCB manufacturer with 1.6mm FR4 94V0 and HAL lead free finishing

Turnkey PCB manufacturer with 1.6mm FR4 94V0 and HAL lead free finishing

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Basic Info
Basic Info
Payment Type: T/T, PayPal
Product Description
Product Description
  • Specifications:
    • Layers: 2
    • Major material: FR4
    • Board thickness: 1.6mm
    • Surface finishing: lead-free
    • Solder mask: blue
    • Copper thickness: 1oz
    • Minimum hole size: 0.3mm
    • Minimum line width and spacing: 4-mil
  • Capabilities:
    • Material: FR4/high Tg FR4/lead-free (RoHS mark)/CEM-3, aluminum, metal based
    • Layers: 2
    • Finishing board thicknesses: 0.2-3.5mm (8-138-mil)
    • Board thickness tolerance: ±10%
    • Copper thicknesses: 0.5-4oz (18-144um)
    • Copper plating hole: 18-40um
    • Impedance control: ±10%
    • Warp and twist: 0.70%
  • Image:
    • Minimum trace width (a): 0.075mm (3-mil)
    • Minimum space width (b): 0.075mm (3-mil)
    • SMD pitch (a): 0.2mm (8-mil)
    • BGA pitch (b): 0.2mm (8-mil)
    • Solder mask:
      • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
      • Solder mask clearance (b): 0.075mm (3-mil)
      • Minimum SMT pad spacing (c): 0.075mm (3-mil)
      • Solder mask thickness: 0.0007-inch (0.018mm)
  • Holes:
    • Minimum hole size (CNC): 0.2mm (8-mil)
    • Minimum punch hole size: 0.9mm (35-mil)
    • Hole size tolerance:
      • PTH: ±0.075mm
      • NPTH: ±0.05mm
    • Hole position tolerance: ±0.075mm
    • Plating:
      • HASL/lead-free HASL: 2.5um
      • Immersion gold nickel: 3-7um Au: 1-5u-inch
      • OSP: 0.2-0.5um
    • Certificates: ISO, SGS and UL
  • Layers: 2
  • Major material: FR4
  • Board thickness: 1.6mm
  • Surface finishing: lead-free
  • Solder mask: blue
  • Copper thickness: 1oz
  • Minimum hole size: 0.3mm
  • Minimum line width and spacing: 4-mil
  • Material: FR4/high Tg FR4/lead-free (RoHS mark)/CEM-3, aluminum, metal based
  • Layers: 2
  • Finishing board thicknesses: 0.2-3.5mm (8-138-mil)
  • Board thickness tolerance: ±10%
  • Copper thicknesses: 0.5-4oz (18-144um)
  • Copper plating hole: 18-40um
  • Impedance control: ±10%
  • Warp and twist: 0.70%
  • Minimum trace width (a): 0.075mm (3-mil)
  • Minimum space width (b): 0.075mm (3-mil)
  • SMD pitch (a): 0.2mm (8-mil)
  • BGA pitch (b): 0.2mm (8-mil)
  • Solder mask:
    • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
    • Solder mask clearance (b): 0.075mm (3-mil)
    • Minimum SMT pad spacing (c): 0.075mm (3-mil)
    • Solder mask thickness: 0.0007-inch (0.018mm)
  • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
  • Solder mask clearance (b): 0.075mm (3-mil)
  • Minimum SMT pad spacing (c): 0.075mm (3-mil)
  • Solder mask thickness: 0.0007-inch (0.018mm)
  • Minimum hole size (CNC): 0.2mm (8-mil)
  • Minimum punch hole size: 0.9mm (35-mil)
  • Hole size tolerance:
    • PTH: ±0.075mm
    • NPTH: ±0.05mm
  • Hole position tolerance: ±0.075mm
  • Plating:
    • HASL/lead-free HASL: 2.5um
    • Immersion gold nickel: 3-7um Au: 1-5u-inch
    • OSP: 0.2-0.5um
  • Certificates: ISO, SGS and UL
  • PTH: ±0.075mm
  • NPTH: ±0.05mm
  • HASL/lead-free HASL: 2.5um
  • Immersion gold nickel: 3-7um Au: 1-5u-inch
  • OSP: 0.2-0.5um

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