Shenzhen Jinhua Electronic Materials Co., Ltd.
Shenzhen Jinhua Electronic Materials Co., Ltd.
Epoxy Resin Adhesive Glue for Hard Material Bonding
  • Epoxy Resin Adhesive Glue for Hard Material Bonding
Epoxy Resin Adhesive Glue for Hard Material Bonding

Epoxy Resin Adhesive Glue for Hard Material Bonding

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Basic Info
Basic Info
Place of Origin: Shenzhen, Guangdong, China
Payment Type: L/C, T/T, Western Union
Product Description
Product Description
Epoxy Resin 630AB
Feature
Epoxy resin adhesive 630AB can be cured under normal temperature and low temperature, easy to operate, with fast curing, high bonding strength, it also can be cured at high temperature.

Application
630AB can be widely used for adhesion for hard materials such as metal parts, electronic components, wood parts, etc..

Properties before Hardening
Part 630A 630B
Color Transparent Transparent
Specific gravity 1.15 1.05
Viscosity (25ºC) 8000-12000CPS 5500~8500CPS
Mixing ratio A: B = 100:100(weight ratio)
Hardening conditions 25 ºC×1H or 55ºC×5 min (2 g)
Usable  time 25ºC×10min (100g)

Operation
1.Weigh A and B glue according to the given weight ratio into the prepared cleaned container, fully mixed the mixture again the container wall by clockwise, place it along for 3 to 5 minutes, and then it can be used.
2.Take the glue according to the usable time and dosage of mixture to avoid wasting. When the temperature is below 15 ºC, please heat A glue to 30 ºC first and then mix it to the B glue (A glue will be thicken in low temperature ); The glue must be sealed lid after use to avoid rejection caused by moisture absorption.
3.When the relative humidity is higher than 85%, the surface of the cured mixture will absorb moisture in the air, and form a layer of white mist in the surface, so when the relative humidity is higher than 85%, is not suitable for room temperature curing, suggest to use the heat curing.

Properties after Hardening
Hardness, shore D <85
Withstand voltage, KV/mm 22
Flexural strength, Kg/mm2 25
Volume resistivity, Ohm3 1x1015
Surface resistance, Ohmm2 5X1015
Thermal conductivity, W/M.K 0.56
Induced electric loss, 1KHZ 0.42
Withstand high temperature, ºC 140
Moisture absorption,  % <0.15
Compressive strength, Kg/ mm2 11.4

Caution
1,The operating environment should be ventilative and should keep away from fire. Closely sealed after use.
2, Avoid eye contact,  in case of contact, wash with plenty of water and get medical attention immediately.
3, If contact skin, wrap with clean cloth or paper, and wash it with water and soap.
4, Keep away from children.
5, Please take a trial before application to avoid usage mistake.
 
Storage And Shelf Life
1, Store at the tempeture of 25°C or cool and dry place.  Avoid from sunlight, high tempeture or hign humidity enviroment.
2, Use up as soon as possible when opened. It is strictly forbidden to expose to the air for a long time after it is opened to avoid affecting the quality of the products. The shelf life is six months in the room tempeture of 25°C.

Notice: The above data is typical data measured by the laboratory environment under
the temperature of 25 ºC, and humidity of 70%. For customers' reference only.

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