Shenzhen X-Mulong Circuit Co., Ltd.
Shenzhen X-Mulong Circuit Co., Ltd.
10laye Impedance Control, Tg150 Material PCB with Immersion Gold, HDI, Buried/Blind Vias PCB
  • 10laye Impedance Control, Tg150 Material PCB with Immersion Gold, HDI, Buried/Blind Vias PCB
10laye Impedance Control, Tg150 Material PCB with Immersion Gold, HDI, Buried/Blind Vias PCB

10laye Impedance Control, Tg150 Material PCB with Immersion Gold, HDI, Buried/Blind Vias PCB

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Basic Info
Basic Info
Place of Origin: China
Payment Type: L/C, T/T, Paypal, Western Union
Product Description
Product Description
10Layer PCB, impedance control, Middle tg Tg150 material, Immersion Gold, HDI, buried/blind vias PCB
Layer qty: 10 layer
Material: Middle Tg150 FR-4, 1.6mm+/-10%, CTI>175
Copper thickness: 1~1 oz finish
Solder mask: LPI green
Surface finish: Immersion Gold, Au thickness: Min. 2u"
Min. 5mil / 5mil trace width and space, Min. Via: 8 mil
Profile: CNC routing, prototype, middle volume, mass production
E-test: 100% Fixture, vacuum package
Quality report: Solderability test, E-test report, Final inspection, RoHS compliant, Lead free, ISO 9001, UL94V-0, IPC CLASS 2
Cetification: UL, RoHS, SGS, ISO9001, TS16949.

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