BGA IC OSP 6 L Multi-Layers Fr4 0.08 Line UL RoHS Certified PCB Board

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Basic Info

Place of Origin:	Shenzhen, China
Payment Type:	L/C, T/T, Paypal, Western Union

Product Description

  Model No.:                      KG-M6-009
Number of Layers:        6L
Base-Material:               FR4
Thickness:                       1.5 mm+/-10%
Final-Cu:                          35um
Impedance:                    No
Blind and buried via:    No
Min. Drill hole:               0.20mm
Min. Line space:            0.08mm
Min. Line width:            0.08mm
Mech. Treatment:         Routing
Surface Treatment:      OSP
  Solder-Mask:                 Green
  Legend-Print:                White
100% E-Test:                 Yes

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