
Plastic Contact IC Card/At24c02/At24c16/At24c64 Contact Smart Card
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Basic Info
Place of Origin: | China |
---|---|
Payment Type: | T/T, Western Union |
Product Description
Product Description
At24c02 ic card
AT24C02 card
Features
Low-voltage and Standard-voltage Operation
2.7 (VCC = 2.7V to 5.5V)
1.8 (VCC = 1.8V to 5.5V)
Internally Organized 256 x 8 (2K)
Two-wire Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
100 kHz (1.8V) and 400 kHz (2.7V, 5V) Compatibility
Write Protect Pin for Hardware Data Protection
8-byte Page (2K) Write Modes
Partial Page Writes Allowed
Self-timed Write Cycle (5 ms max)
High-reliability
Endurance: 1 Million Write Cycles
Data Retention: 100 Years
Automotive Devices Available
8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2× 3), 5-lead SOT23, 8-lead TSSOP and 8-ball dBGA2 Packages
Die Sales: Wafer Form, Waffle Pack and Bumped Wafers
AT24C02 card
Features
Low-voltage and Standard-voltage Operation
2.7 (VCC = 2.7V to 5.5V)
1.8 (VCC = 1.8V to 5.5V)
Internally Organized 256 x 8 (2K)
Two-wire Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
100 kHz (1.8V) and 400 kHz (2.7V, 5V) Compatibility
Write Protect Pin for Hardware Data Protection
8-byte Page (2K) Write Modes
Partial Page Writes Allowed
Self-timed Write Cycle (5 ms max)
High-reliability
Endurance: 1 Million Write Cycles
Data Retention: 100 Years
Automotive Devices Available
8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2× 3), 5-lead SOT23, 8-lead TSSOP and 8-ball dBGA2 Packages
Die Sales: Wafer Form, Waffle Pack and Bumped Wafers
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