
LED PCB Electronic Circuit Board PCB Board Prototype LED
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Basic Info
Place of Origin: | China |
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Payment Type: | L/C, T/T, Western Union |
Product Description
Product Description
LED PCB Electronic Circuit Board pcb board prototype led
ItemsCapability
1Min. IC Pitch0.30mm(12mil)
2Foot PinSO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
3Min. Chip Placement 01005
4Max. PCB Size410mm X 600mm(16.2" X 23.6")
5Min. PCB Thickness0.35mm(13.8mil)
6Maximum BGA Size74mm X 74mm(2.9" X 2.9")
7BGA Ball Pitch1mm ~ 3mm(4mil ~ 12mil)
8BGA Ball Diameter0.4mm ~ 1mm(16mil ~ 40mil)
9QFP Lead Pitch0.38mm ~ 2.54mm(15mil ~ 100mil)
10PackageAnti-static Bubble Bag & Carton
PCB Capability
ItemsCapability
1Layers1 ~ 30 layers
2Base MaterialFR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium
3Finished Board Thickness0.2mm ~ 7.0mm(8mil-276mil)
4Copper Thickness1/3oz ~ 7oz
5Surface FinishingHASL, Lead Free HASL, Immersion tin, Immersion gold, Gold plating, Immersion silver, OSP, Carbon, etc.
6Reference StandardIPC-A-600H Class 2, Class 3, TS16949
7CertificateUL, ISO9001, RoHS, SGS
8PackageVacuum & Carton
FPC Capability
ItemsCapability
1TypesSingle-sided, Double-sided, Multi-layers (max 6 layers) and
Flex-Rigid PCB
2Surface FinishingHASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek)
3Base MaterialPolyimide(Kapton), Polyester(PET), FR4
4Soldering Thermal Resistance300° C/10 seconds
5Performance Test100% electrical and electricity performance test
ItemsCapability
1Min. IC Pitch0.30mm(12mil)
2Foot PinSO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
3Min. Chip Placement 01005
4Max. PCB Size410mm X 600mm(16.2" X 23.6")
5Min. PCB Thickness0.35mm(13.8mil)
6Maximum BGA Size74mm X 74mm(2.9" X 2.9")
7BGA Ball Pitch1mm ~ 3mm(4mil ~ 12mil)
8BGA Ball Diameter0.4mm ~ 1mm(16mil ~ 40mil)
9QFP Lead Pitch0.38mm ~ 2.54mm(15mil ~ 100mil)
10PackageAnti-static Bubble Bag & Carton
PCB Capability
ItemsCapability
1Layers1 ~ 30 layers
2Base MaterialFR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium
3Finished Board Thickness0.2mm ~ 7.0mm(8mil-276mil)
4Copper Thickness1/3oz ~ 7oz
5Surface FinishingHASL, Lead Free HASL, Immersion tin, Immersion gold, Gold plating, Immersion silver, OSP, Carbon, etc.
6Reference StandardIPC-A-600H Class 2, Class 3, TS16949
7CertificateUL, ISO9001, RoHS, SGS
8PackageVacuum & Carton
FPC Capability
ItemsCapability
1TypesSingle-sided, Double-sided, Multi-layers (max 6 layers) and
Flex-Rigid PCB
2Surface FinishingHASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek)
3Base MaterialPolyimide(Kapton), Polyester(PET), FR4
4Soldering Thermal Resistance300° C/10 seconds
5Performance Test100% electrical and electricity performance test
Related Keywords
Related Keywords