
Servo Drive PCB Assembly /SMT PCB
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Basic Info
Place of Origin: | China |
---|---|
Payment Type: | T/T, Western Union, Paypal |
Product Description
Product Description
With 10 years experience We can do for you:
PCB assembly, PCBA, SMT, DIP process:
1) Surface-mounting Technology(SMT) and Through-hole/DIP
2) components SMT technology and lead free technology
3) ICT(In Circuit Test), FCT(Functional Circuit Test) technology
4) UL, CE, FCC, RoHS standard
5) Complicated boards and components are available
6) Provides OEM services to all sorts of printed circuit board assembly
7) ISO 9001: 2008 Factory located in Shenzhen, China
1. Detailed Specification of PCB Manufacturing
PCB Process Capability
Processing layers: 1- 30 layers
Finished thickness: 0.008 "~ 0.24" (0.20mm ~ 6.0mm)
Minimum aperture: 6mil (0.15mm)
Minimum line width / spacing: 3-4 mil (0.076-0.10mm)
Maximum board size: Single & Double 22 "X 43" (550 X1100mm), Multi-layer 22 "X 25" (550mm X 640mm)
Impedance Control: ± 10%
Surface Treatment: OSP, HASL, Electric Nickel / Gold, Chemical nickel / gold, lead-free HASL, Gold finger, immersion Silver, Immersion Tin.
Base materials: FR4 ( ShengYi, KB, International), high TG (TG150, TG170), halogen-free board (Halogen-free), High frequency plate (Rogers, Teflon, Taconic), made PTFE (PTFE), AL aluminum plate (Berquist, Al-made basis), copper (Cu Base), Iron (Fe Base), Ceramic substrate (Ceramic Base)
2. Detailed Terms for PCB Assembly
Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206, 0805, 0603 components SMT technology
3) ICT(In Circuit Test), FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL, CE, FCC, RoHS Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
Please provide following information for getting a quote:
Gerber files of the bare PC board
BOM list to include: Manufacturer's part number, type of part, packaging type, component locations and quantity
Dimensional specification for non-standard components
Assembly drawing
Final test procedures (if applicable)
In order to shorten the lead time, please advise us alternative parts (same specifications but different brand name)
Estimated order quantity
If possible, please send prototype/sample board/photo to us for further reference
PCB assembly, PCBA, SMT, DIP process:
1) Surface-mounting Technology(SMT) and Through-hole/DIP
2) components SMT technology and lead free technology
3) ICT(In Circuit Test), FCT(Functional Circuit Test) technology
4) UL, CE, FCC, RoHS standard
5) Complicated boards and components are available
6) Provides OEM services to all sorts of printed circuit board assembly
7) ISO 9001: 2008 Factory located in Shenzhen, China
1. Detailed Specification of PCB Manufacturing
PCB Process Capability
Processing layers: 1- 30 layers
Finished thickness: 0.008 "~ 0.24" (0.20mm ~ 6.0mm)
Minimum aperture: 6mil (0.15mm)
Minimum line width / spacing: 3-4 mil (0.076-0.10mm)
Maximum board size: Single & Double 22 "X 43" (550 X1100mm), Multi-layer 22 "X 25" (550mm X 640mm)
Impedance Control: ± 10%
Surface Treatment: OSP, HASL, Electric Nickel / Gold, Chemical nickel / gold, lead-free HASL, Gold finger, immersion Silver, Immersion Tin.
Base materials: FR4 ( ShengYi, KB, International), high TG (TG150, TG170), halogen-free board (Halogen-free), High frequency plate (Rogers, Teflon, Taconic), made PTFE (PTFE), AL aluminum plate (Berquist, Al-made basis), copper (Cu Base), Iron (Fe Base), Ceramic substrate (Ceramic Base)
2. Detailed Terms for PCB Assembly
Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206, 0805, 0603 components SMT technology
3) ICT(In Circuit Test), FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL, CE, FCC, RoHS Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
Please provide following information for getting a quote:
Gerber files of the bare PC board
BOM list to include: Manufacturer's part number, type of part, packaging type, component locations and quantity
Dimensional specification for non-standard components
Assembly drawing
Final test procedures (if applicable)
In order to shorten the lead time, please advise us alternative parts (same specifications but different brand name)
Estimated order quantity
If possible, please send prototype/sample board/photo to us for further reference
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