PCBA for LED Light OEM Service
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Basic Info
| Place of Origin: | China |
|---|---|
| Payment Type: | L/C, T/T, D/P, Paypal, Western Union |
Product Description
Product Description
PCB Assembly Capability
Items Capability
1 Min. IC Pitch 0.30mm(12mil)
2 Foot Pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
3 Min. Chip Placement 01005
4 Max. PCB Size 410mm x 600mm(16.2" x 23.6")
5 Min. PCB Thickness 0.35mm(13.8mil)
6 Maximum BGA Size 74mm x 74mm(2.9" x 2.9")
7 BGA Ball Pitch 1mm ~ 3mm(4mil ~ 12mil)
8 BGA Ball Diameter 0.4mm ~ 1mm(16mil ~ 40mil)
9 QFP Lead Pitch 0.38mm ~ 2.54mm(15mil ~ 100mil)
10 Package Anti-static Bubble Bag & Carton
PCB Capability
Items Capability
1 Layers 1 ~ 30 layers
2 Base Material FR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium
3 Finished Board Thickness 0.2mm ~ 7.0mm(8mil-276mil)
4 Copper Thickness 1/3oz ~ 7oz
5 Surface Finishing HASL, Lead Free HASL, Immersion tin, Immersion gold, Gold plating, Immersion silver, OSP, Carbon, etc.
6 Reference Standard IPC-A-600H Class 2, Class 3, TS16949
7 Certificate UL, ISO9001, ROHS, SGS
8 Package Vaccum & Carton
FPC Capability
Items Capability
1 Types "Single-sided, Double-sided, Multi-layers (max 6 layers) and
Flex-Rigid PCB"
2 Surface Finishing HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek)
3 Base Material Polyimide(Kapton), Polyester(PET), FR4
4 Soldering Thermal Resistance 300° C/10 seconds
5 Performance Test 100% electrical and electricity performance test
Items Capability
1 Min. IC Pitch 0.30mm(12mil)
2 Foot Pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
3 Min. Chip Placement 01005
4 Max. PCB Size 410mm x 600mm(16.2" x 23.6")
5 Min. PCB Thickness 0.35mm(13.8mil)
6 Maximum BGA Size 74mm x 74mm(2.9" x 2.9")
7 BGA Ball Pitch 1mm ~ 3mm(4mil ~ 12mil)
8 BGA Ball Diameter 0.4mm ~ 1mm(16mil ~ 40mil)
9 QFP Lead Pitch 0.38mm ~ 2.54mm(15mil ~ 100mil)
10 Package Anti-static Bubble Bag & Carton
PCB Capability
Items Capability
1 Layers 1 ~ 30 layers
2 Base Material FR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium
3 Finished Board Thickness 0.2mm ~ 7.0mm(8mil-276mil)
4 Copper Thickness 1/3oz ~ 7oz
5 Surface Finishing HASL, Lead Free HASL, Immersion tin, Immersion gold, Gold plating, Immersion silver, OSP, Carbon, etc.
6 Reference Standard IPC-A-600H Class 2, Class 3, TS16949
7 Certificate UL, ISO9001, ROHS, SGS
8 Package Vaccum & Carton
FPC Capability
Items Capability
1 Types "Single-sided, Double-sided, Multi-layers (max 6 layers) and
Flex-Rigid PCB"
2 Surface Finishing HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek)
3 Base Material Polyimide(Kapton), Polyester(PET), FR4
4 Soldering Thermal Resistance 300° C/10 seconds
5 Performance Test 100% electrical and electricity performance test
Related Keywords
Related Keywords
