Reflow Soldering Oven

Features:
l windows operating interface is adopted and two control methods, including PC contorl and emergency maual control, are designed to ensure the safty of the device.
l The advanced way of heating solves the problem of the dead angle that may arise when reflow soldering.
l Professional wind wheel design with stable blowing speed which effectively avoids evenness of the wind when PCB is being heated. so as to achieve a most efficient reheating.
l Regions of different temperature adopt the circulation independent from each other, with indenpend PID control and up/down heating method method, so as to ensure the accurate and even temperature of the furance and large thermal capacity.
l The heating preservation layer adopts quality aluminum silicate heat preserving material, with good preservation effect and high heating-up speed. It takes 20min to heat up working temperature from room temperature.
l Special furance liner design ,with good heat preservation ability and low power consumption.
l Quality high-temperature high-speed motor is running stably with light vibration and low noise
l The furnace is jacked by cylinder and supported by safety rod to ensure safety and convenience
l The PCB is conveyed non-level with changed frequency speed and synchronous grid and chain to ensure great stabiity.
l UPS function is equipped to ensure normal output of PCB after power break and avoid damage.
l The software has powerful function. It can measure the temperature of the PCB online and can analyze ,save and print the data and curve from time to time.
l PC and PLC adoptsPC/PP protocol to communication with each other which ensures stable working and avoids system down .Auto detecting and showing working status of the device.
l Enforced air cooling ;PCB temperature≤60°C after outputting