SMT Hot Air Reflow Oven

Features:
L windows operating interface is adopted and two control methods, including PC control and emergency manual control, are designed to ensure the safety of the device.
L The advanced way of heating solves the problem of the dead angle that may arise when reflow soldering.
L Professional wind wheel design with stable blowing speed which effectively avoids evenness of the wind when PCB is being heated. So as to achieve a most efficient reheating.
L Regions of different temperature adopt the circulation independent from each other, with independent PID control and up/down heating method method, so as to ensure the accurate and even temperature of the furnace and large thermal capacity.
L The heating preservation layer adopts quality aluminum silicate heat preserving material, with good preservation effect and high heating-up speed. It takes 20min to heat up working temperature from room temperature.
L Quality high-temperature high-speed motor is running stably with light vibration and low noise
L The furnace is jacked by cylinder and supported by safety rod to ensure safety and convenience.
L The PCB is conveyed non-level with changed frequency and speed and synchronous grid and chain to ensure great stability.
L Special quality aluminum alloy guide rail is adopted and auto fuel feeding system ensures the debugging accuracy of the guild rail as well as its use life.
L UPS function is equipped to ensure normal output of PCB after power break and avoid damage.
L The software has powerful function. It can measure the temperature of the PCB online and can analyze, save and print the data and curve from time to time.
L PC and PLC adopts PC/PP protocol to communication with each other which ensures stable working and avoids system down. Auto detecting and showing working status of the device.
L Enforced air cooling; PCB temperature≤ 60° C.
L Special furnace liner design, with good heat preservation ability and low power consumption.