
Multilayer PCB (HY003)
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- T/T
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Basic Info
Place of Origin: | China |
---|---|
Payment Type: | T/T |
Product Description
Product Description
Product Description
8 layers
Base material: FR4 1.6mm
Inner copper thickness: 17um
Outter copper thickness: 35um
Solder mask: Green *2
Surface treatment: Immersion Gold
Min track width/space: 0.1/0.1mm
Min hole: 0.2mm
Profile: Milling
Buried and Blind via
Impedance control
A. O. I and E-test
Base material: FR4 1.6mm
Inner copper thickness: 17um
Outter copper thickness: 35um
Solder mask: Green *2
Surface treatment: Immersion Gold
Min track width/space: 0.1/0.1mm
Min hole: 0.2mm
Profile: Milling
Buried and Blind via
Impedance control
A. O. I and E-test
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