Shenzhen Hong Ye Jie Technology Co., Ltd.
Shenzhen Hong Ye Jie Technology Co., Ltd.
liquid encapsulating silicone for electronics
  • liquid encapsulating silicone for electronics
  • liquid encapsulating silicone for electronics
  • liquid encapsulating silicone for electronics
  • liquid encapsulating silicone for electronics
liquid encapsulating silicone for electronics
liquid encapsulating silicone for electronics
liquid encapsulating silicone for electronics
liquid encapsulating silicone for electronics

liquid encapsulating silicone for electronics

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Basic Info
Basic Info
Product Description
Product Description
  • Product Details

Basic Specification

state condensation
catalyst FOC
Cetification ISO9001:2000,SGS,RoHS
validity 1 year
feature two part silicone,liquid
Eco-Friendly Yes
Test Report SGS

Detail Description

Usage of liquid encapsulating silicone for electronics :

Filling for leds, electronic display, circuit board, solar panels, pv cells,machinery,electrical connections

 

Description of liquid encapsulating silicone for electronics:

HY210 is a type of two-component encapsulation silicone cured at room temperature.HY 210 works on the surface of material as PC(Poly-carbonate),ABS,PP,PVC as to its superior bonding feature. It is also applicable for insulation, waterproof and bonding of electronics parts. It has many merits, such as chemical resistance, good thermal transfering ability, and it meets the requirements of European ROHs, UL94-V1. Hong Ye Technology is one of the best silicone rubber suppliers in China.

 

Technical Parameters:

  • Properties index

    Part A

    Part B

    Before Curing

     

    Appearance

    Transparent liquid

    yellowish fluid

    Viscosity(cps)

    3000±500

    Features when operation

    Mixing Ratio(By weight)

    10:1

    Operating Time(25°C /min)

    60~120

    Curing time(hrs,basically cured)

    3

    Curing time(hrs,perfectly cured)

    24

    Hardness (shore A)

    15±3

     

    AfterCuring

    Thermal Conductivity[W(m·K)]

    ≥0.2

    Dielectric Strength(kV/mm)

    ≥25

    Dielectric permittivity(1.2MHz)

    3.0~3.3

    Volume resistivity(Ω·cm)

    ≥1.0×1016

    Fire Resistance

    UL94-V1

(Please note: all data of this product above in 25°C with 55% humidity conditions. We don\' t guarantee a same date if testing under different conditions, or when data was regenerated)

 

Warm tips for the electrical potting silicone:

1.Sealing package for storage. The mixture should be used up at once to avoid wasting.

2. The thermal transfer silicone belongs to non-dangerous goods, but keeps away form mouth and eyes.

3. When it gets stratified after a period of storage, Please mix HY 210 evenly before using, it does not affect

the performance.

 

Package of liquid encapsulating silicone for electronics:

HY210: 22kg/set (Part A 20kg + Part B 2kg)

 

Shelf life and transportation:

1.Twelve(12) months when stored at 24°C in original unopened packages.

2. This kind of product is non-dangerous product, it can be transported as general chemicals.

3. Products exceed the storage life should be confirmed normal before using.

 

 

Technical guidelines:

1.Please put part A and B in separate container and stir evenly before mixing the two parts together.

2. Weight Ratio: part A: part B = 10:1

3.Bubble release if necessary , deaeration the mixture under 0.08 MPa for 3 minutes.

4. HY 210 is cured at room temperature, so please put it under room temperature after pouring. It comes to

next process when basically cured, and it takes about 24 hours for completely cured.

Kindly note: Temperature and Humidity with tremendous influences for curing of HY210.

 

 

Additional Information

Payment Terms L/C, T/T, Western Union
Minimum Order 200KG
Lead Time / Delivery Time 5 Day(s)
Sample Available YES
Delivery Details within 3 days after payment confirmed in our bank
FOB Port Shenzhen
Loading Info by sea or by air
Packing Info 25kg/drum and 25kg/drum
Target Market(s) North America, Oceania, Southeast Asia, Eastern Europe, Africa(except Middle East), Hong Kong/ Macao/ Taiwan, Latin America, Japan & Korea, Middle East & South Asia, Mainland China, Western & Southern Europe, Northern Europe, Central & Southern Asia, Middle East

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