4 Layer Printed Circuit Board Pcb

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Basic Info

Product Description

Packaging & Delivery

Packaging Detail:	Inner packing: Vacuum packing / Plastic bag Outer packing: Standard carton packing
Delivery Detail:	Prototype:2 days for 2L; 4 days for 4L; MP:7days

Specifications

1. PCB Design ;
2. Certificate: UL, ISO 9001, ISO 14001 ;
3. Fast action/24hours quotation ;
4. Multilayer pcb manufacturer .

Multilayer PCB Design:

Layer: 1 to 28 layers

Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers

Board thickness: 0.21mm to 7.0mm

Copper thickness: 0.5 OZ to 7.0 OZ

Copper thickness in hole: >25.0 um (>1mil)

Size:

- Max. Board Size: 23 × 25 (580mm×900mm)

- Min. Drilled Hole Size: 3mil (0.075mm)

- Min. Line Width: 3mil (0.075mm)

- Min. Line Spacing: 3mil (0.075mm)

Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

Solder Mask Color: Green/Yellow/Black/White/Red/Blue

Multilayer PCB Design

Why buy from us?

1. Automated equipments to reduce the cost,

2. Our prices are very competitive and quality is super

3. Fast action/24hours quotation

4. Quick prototyping and production

Our Production Capability for PCB:

Layer	1 to 28 layers
Material type	FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness	0.21mm to 7.0mm
Copper thickness	0.5 OZ to 7.0 OZ
Copper thickness in hole	>25.0 um (>1mil)
Size	- Max. Board Size: 23 × 25 (580mm×900mm)
	- Min. Drilled Hole Size: 3mil (0.075mm)
	- Min. Line Width: 3mil (0.075mm)
	- Min. Line Spacing: 3mil (0.075mm)
Surface finishing	HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Tolerance	- Shape tolerance: ±0.13
Tolerance	- Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Certificate	UL, ISO 9001, ISO 14001
Special requirements	Buried and blind vias+controlled impedance +BGA
Profiling	Punching, Routing, V-CUT, Beveling
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.