NAND Flash Testing Solution--BGA Test Solution

NAND Flash Testing Solution--BGA Test Solution

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Min. Order:: 1

Min. Order:: 1

Delivery Time:: 7 Days

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Basic Info

Place of Origin:	shenzhen,china

Product Description

1. Spinning structure,easy to operate.

2. Pogo Pin solution,support high-low temperature testing,longer life span and stable performance..

3. Adopt Torlon as insulating material.

4. (Pusher)pressure adjustable, compatible with different IC thickness. make sure pressure could be applied evenly on IC and prolong the life span of probe pin.

5. Frame is changeable,compatible with different IC size

6. Accurate positioning of IC.

7. Engineering material, high durability and apply to different environment.perfect insulating performance.

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Related Keywords

NAND Flash Testing Solution , BGA Test Socket , Memory IC Testing