NAND Flash Testing Solution--eMCP Test Solution/SD
- Min. Order:
- 1
- Min. Order:
- 1
- Delivery Time:
- 7 Days
Your message must be between 20 to 2000 characters
Contact Now| Place of Origin: | shenzhen,china |
|---|
1. Manual clamshell structure,easy to operate.
2. Pogo Pin solution,support high-low temperature testing,longer life span and stable performance..
3. Adopt Torlon as insulating material.
4. Advanced SD adapter,compatibility ≤ 4.4 version.much faster in reading.
5. (Pusher)pressure adjustable, compatible with different IC thickness. make sure pressure could be applied evenly on IC and prolong the life span of probe pin.
6. Frame is changeable,compatible with different IC size(11.5x13/12x16)
7. Accurate positioning of IC.
8. Patent structure,patented No:ZL 2012 2 0056976.7, zero abrasion on the structure and
9. Engineering material, high durability and apply to different environment.perfect insulating performance.
Related Keywords
