| Place of Origin: | China |
|---|---|
| Certificate: | ISO9001 |
As a technical manufacturer specializing in the printed circuit board& pcb assembly industry,Whether you need rigid pcb circuit boards, flexible PCB(FPC), rigid flex pcb circuits or aluminum clad pcb circuit boards, FZ PCB's manufacturing solutions can help.
Rigid PCB from Single-sided up to 16 layers (thickness 0.4mm Min., 3.2mm Max)
FZ-PCB Company Profile
·Established in 2002
·Privately owned company
·10,700 Square feet Facility
·Nearly 600 Employees
·21,000 Square feet Monthly output
·Specialize in Prototypes to large batch production
·High technology multilayer PCBs
·HDI and Sequential Lamination
·Flexible, Flex-rigid and Rigid PCBs
·Turnover USD$16 Million (2012-2013)
·RoHS/UL, ISO9001:2000 & ISO/TS16949:2002
What will you get from FZ-PCB
·Reliable and stable quality with more than 12 years pcb manufacturing experience.
·Quick response & 24 hours available service.
·Professional sales service & advice.
·Fulfillment of our promises, NO lies.
·Protecting your Intellectual property. All our staff of trained professionals are ·working under a strict confidential contract.
Market Segment
Delivery Timescales
Sample
·Single layer 5 days
·Double Side 5-7days
·4 ~ 6 layers 8-10days
·Above 8 layers 10-14days
·Aluminum PCB 7-10days
·Flexible PCB 10-14days
* Urgent Routing sample could be pushed 2-3 days earlier with premium.
Mass Production
·Double Side standard 13days
·4~6 layers standard 15days
·above 8 layers standard 18days
·Aluminum PCB standard 15days
·Flexible PCB standard 18days
* Material availability dependant.
Factory galance
Package & Shipping Method:
1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement
Payment method
1. T/T
2. Paypal
3. Western Union
PCB Production Capability:
|
Files |
Gerber, Protel, Powerpcb, Autocad, Orcad, etc |
|
Material |
FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic) |
|
Layer No. |
1 - 12 Layers |
|
Board thickness |
0.0075"(0.2mm)-0.125"(3.2mm) |
|
Board Thickness Tolerance |
10% |
|
Copper thickness |
0.5OZ - 4OZ |
|
Impedance Control |
10% |
|
Warpage |
0.075%-1.5% |
|
Peelable |
0.012"(0.3mm)-0.02`(0.5mm) |
|
Min Trace Width (a) |
0.004"(0.1mm) |
|
Min Space Width (b) |
0.004"(0.1mm) |
|
Min Annular Ring |
0.004"(0.1mm) |
|
SMD Pitch (a) |
0.012"(0.3mm) |
|
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) |
0.027"(0.675mm) |
|
Regesiter torlerance |
0.05mm |
|
Min Solder Mask Dam (a) |
0.005"(0.125mm) |
|
Soldermask Clearance (b) |
0.005"(0.125mm) |
|
Min SMT Pad spacing (c) |
0.004"(0.1mm) |
|
Solder Mask Thickness |
0.0007"(0.018mm) |
|
Hole size |
0.008"(0.20mm)-- 0.257"(6.5mm) |
|
Hole Size Tol (+/-) |
0.003"(0.0762mm) |
|
Aspect Ratio |
10:01 |
|
Hole Registration |
0.003"(0.075mm) |
|
HASL |
2.5um |
|
Lead free HASL |
2.5um |
|
Immersion Gold |
Nickel 3-7um Au:1-3u'' |
|
OSP |
0.2-0.5um |
|
Panel Outline Tol (+/-) |
0.004''(0.1mm) |
|
Beveling |
3045 |
|
V-cut |
15 30 45 60 |
|
Surface finish |
HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
|
Certificate |
ROHS ISO9001 TS16949 SGS UL |
|
Special requirements |
Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger |
Related Keywords
